IC socket
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United States of America Patent
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Apr 3, 2007
Grant Date -
Apr 29, 2004
app pub date -
Mar 27, 2002
filing date -
Apr 3, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
The invention provides an IC socket of synthetic resin, whose surface resistivity is strictly controlled to the desired level and which is much more improved in terms of electrical insulation properties, mechanical properties, heat resistance, chemical resistance, dimensional stability, etc. The IC socket is obtained by molding or otherwise forming a thermoplastic resin composition comprising 40 to 94% by mass of a thermoplastic resin, 5 to 30% by mass of a carbon precursor having a volume resistivity of 10.sup.2 to 10.sup.10 .OMEGA.cm and 1 to 30% by mass of an electrical conductive filler having a volume resistivity of less than 10.sup.2 .OMEGA.cm.
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