Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier
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United States of America Patent
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-
Mar 27, 2007
Grant Date -
Nov 11, 2004
app pub date -
May 9, 2003
filing date -
May 9, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of fabricating a lapping carrier is provided that includes the steps of defining at least one opening extending through a workpiece that is sized to receive a wafer, and cryogenically tempering the workpiece to produce a lapping carrier. By cryogenically tempering the workpiece, the conversion of the crystalline structure of the workpiece to a martensite crystalline structure is enhanced, thereby improving the hardness of the lapping carrier. A lapping carrier is also provided that has a crystalline structure, of which at least 70% is a martensite crystalline structure. An apparatus for lapping a wafer is further provided that includes a hardened lapping carrier and at least one lapping plate proximate the lapping carrier for lapping wafer(s) disposed within the at least one opening defined by the lapping carrier.
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