Apparatus and method for mounting or wiring semiconductor chips
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United States of America Patent
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Mar 20, 2007
Grant Date -
Mar 17, 2005
app pub date -
Sep 10, 2004
filing date -
Sep 12, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for mounting semiconductor chips onto a substrate contains a measuring station for the contactless measurement of the height of the surface of the mounted semiconductor chip facing away from the substrate at a minimum of three locations. From this, at least one parameter is calculated that characterises the adhesive layer formed between the semiconductor chip and the substrate. A difference of the measured value to a set value is used to adjust the mounting process. An apparatus for wiring semiconductor chips also contains such a measuring station in order to determine the individual height of each connection point on the semiconductor chip. This information is used in order to lower the capillary to the respective connection point on the semiconductor chip in the shortest possible time.
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