Intermediate chip module, semiconductor device, circuit board, and electronic device
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United States of America Patent
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Mar 20, 2007
Grant Date -
May 19, 2005
app pub date -
Sep 22, 2004
filing date -
Sep 26, 2003
priority date (Note) -
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Abstract
An intermediate chip for electrically connecting semiconductor chips includes: a substrate having a first side and a second side; a trans-substrate conductive plug which projects to the first side of the substrate; a post electrode which is displaced from the trans-substrate conductive plug in plan view on the second side of the substrate; and wiring which is disposed in or on the substrate for coupling the trans-substrate conductive plug and the post electrode.
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