Integrated circuit on corrugated substrate
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United States of America Patent
Stats
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Mar 13, 2007
Grant Date -
Jan 4, 2007
app pub date -
Jul 1, 2005
filing date -
Jul 1, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
By forming MOSFETs on a substrate having pre-existing ridges of semiconductor material (i.e., a 'corrugated substrate'), the resolution limitations associated with conventional semiconductor manufacturing processes can be overcome, and high-performance, low-power transistors can be reliably and repeatably produced. Forming a corrugated substrate prior to actual device formation allows the ridges on the corrugated substrate to be created using high precision techniques that are not ordinarily suitable for device production. MOSFETs that subsequently incorporate the high-precision ridges into their channel regions will typically exhibit much more precise and less variable performance than similar MOSFETs formed using optical lithography-based techniques that cannot provide the same degree of patterning accuracy. Additional performance enhancement techniques such as pulse-shaped doping and 'wrapped' gates can be used in conjunction with the segmented channel regions to further enhance device performance.
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Patent Citation Ranking
- 307 Citation Count
- H01L Class
- 96.74 % this patent is cited more than
- 18 Age
