Thermal interface material and solder preforms
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United States of America Patent
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Mar 6, 2007
Grant Date -
Oct 14, 2004
app pub date -
Nov 25, 2003
filing date -
May 24, 2001
priority date (Note) -
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Abstract
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
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