Efficient analysis of organic additives in an acid copper plating bath
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United States of America Patent
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Mar 6, 2007
Grant Date -
Dec 1, 2005
app pub date -
May 27, 2004
filing date -
May 27, 2004
priority date (Note) -
Expired
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Abstract
Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two analyses. The suppressor analysis is performed first and the suppressor concentration in the resulting measurement solution is adjusted to a predetermined value corresponding to full suppression. This fully-suppressed solution is then used as the background electrolyte for the anti-suppressor analysis. This integrated analysis approach provides results comparable to those obtained with cell cleaning and rinsing between the analyses but significantly reduces the analysis time, consumption of expensive chemicals, and quantity of hazardous waste generated.
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