Method for calibrating a bondhead
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United States of America Patent
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-
Feb 27, 2007
Grant Date -
Jun 23, 2005
app pub date -
Dec 8, 2004
filing date -
Dec 22, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The position of the gripper axis of the chip gripper of a bondhead of an apparatus for mounting semiconductor chips is determined with the aid of a stationary arranged photodetector. The chip gripper contains a suction organ with a suction opening that defines the position of the gripper axis. The chip gripper contains a shaft with a longitudinal drill hole to which vacuum can be applied that is illuminated so that light emerges out of the suction opening of the suction organ. The bondhead is moved over edges of the photodetector and co-ordinates that characterise the position of the gripper axis are determined from the output signal of the photodetector and the position signal of the bondhead. If this method is carried out for different rotary positions of the chip gripper, then any offset of the gripper axis relative to the rotational axis of the bondhead can also be determined.
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