Device for joining substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Feb 27, 2007
Grant Date -
May 20, 2004
app pub date -
Mar 1, 2002
filing date -
Mar 21, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus is provided for joining together substrates, which have an inner hole, to form a substrate disk. An expandable element is introducible into the inner hole of at least two superimposed substrates. The element is expandable to such an extent that it can come into contact with the inner holes of both of the substrates to close off an intermediate space formed between the substrates relative to the environment. A substrate support is rotatable about an axis of rotation perpendicular to a support surface thereof. A centering device is rotatably coupled with the substrate support and is movable relative thereto in the direction of the axis of rotation. The expandable element is disposed, and is compressible, between the substrate support and the centering device.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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STEAG HAMATECH AG | 75447 STERNENFELS |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Hupp, Alexander | Sulzfeld, DE | 4 | 2 |
# of filed Patents : 4 Total Citations : 2 | |||
Michels, Frank | Knittlingen, DE | 17 | 120 |
# of filed Patents : 17 Total Citations : 120 | |||
Speer, Ulrich | Eisingen, DE | 9 | 12 |
# of filed Patents : 9 Total Citations : 12 | |||
Wagner, Roland | Bretten, DE | 145 | 1415 |
# of filed Patents : 145 Total Citations : 1415 |
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Patent Citation Ranking
- 0 Citation Count
- B32B Class
- 0 % this patent is cited more than
- 18 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Mar 28, 2011 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Feb 27, 2011 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Feb 27, 2011 |
Feb 27, 2011 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | |
Oct 04, 2010 | REMI | MAINTENANCE FEE REMINDER MAILED | |
Apr 17, 2007 | CC | CERTIFICATE OF CORRECTION | |
Feb 27, 2007 | I | Issuance | |
May 20, 2004 | P | Published | |
Sep 10, 2003 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUPP, ALEXANDER;SPEER, ULRICH;WAGNER, ROLAND;AND OTHERS;REEL/FRAME:015125/0984 Owner name: STEAG HAMATECH AG, GERMANY Effective Date: Sep 10, 2003 |
Mar 01, 2002 | F | Filing | |
Mar 21, 2001 | PD | Priority Date |

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