Method for dynamically aligning substrates bearing printed reference marks and codes for automated cutting or scoring, and substrates so cut or scored
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United States of America Patent
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Feb 27, 2007
Grant Date -
Aug 4, 2005
app pub date -
Jan 29, 2004
filing date -
Jan 29, 2004
priority date (Note) -
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Abstract
A substrate to be cut and/or scored is pre-printed with graphics, at least first and second registration marks, and optional encoded-to-print instructions, bar-encoded data, as well as ordinary graphics. The registration marks are sensed as the substrate is automatically transported to a cutting table station that defines a cutting reference plane. Sensed detection of location of the registration marks relative to the reference plane enable the cutting plan for the substrate to be amended for precise location of the graphics on the substrate relative to the reference plane. Automated cutting according to the amended cutting plan occurs. As the registration marks were printed simultaneously with and in known relationship to the graphics, the cut line will be precise relative to the graphics. Machine readable encoded-to-print instructions optionally printed on the substrate can further amend the cutting plan.
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