Fiber optic module packaging architecture for integrated circuit and optical subassembly integration
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United States of America Patent
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Feb 20, 2007
Grant Date -
Sep 1, 2005
app pub date -
Feb 26, 2004
filing date -
Feb 26, 2004
priority date (Note) -
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Abstract
A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.
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