Die clamping apparatus and die clamping method
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United States of America Patent
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-
Feb 20, 2007
Grant Date -
Feb 3, 2005
app pub date -
Jun 25, 2004
filing date -
Aug 1, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a die clamping apparatus wherein a movable platen is moved toward a stationary platen, and after a half nut is engaged with an engaging part of a tie bar, the tie bar is pulled by a die clamping cylinder for clamping, provision is made of a first engaging position adjusting mechanism for controlling a movement of the tie bar or the half nut to a half nut engaging position at the time of die thickness adjustment and a second engaging position adjusting mechanism which allows the tie bar or the half nut to move and which moves the tie bar or the half nut to the half nut engaging position at the time of molding.
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