Packaging structure of electronic card

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7177159
APP PUB NO 20050243532A1
SERIAL NO

11094175

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
3 VIEW TECHNOLOGY CO LTDNO 436 CHUNG JEN RD HSIN CHU R O C

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Hank Hsin Chu, TW 7 58
Wang, Hung Tse Hsin Chu, TW 2 5

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