Method of eliminating curl for devices on thin flexible substrates, and devices made thereby
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United States of America Patent
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Feb 13, 2007
Issued Date -
N/A
app pub date -
Jan 25, 2006
filing date -
Jan 26, 2005
priority date (Note) -
Expired
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Abstract
A thin film semiconductor device such as a photovoltaic device is fabricated on a lightweight substrate material which is affixed to a layer of material which is in turn supported by a carrier. Following the fabrication of the device, the carrier is removed such as by an etching process, leaving the layer of material adhered to the substrate. The adhered layer provides a balancing force to the back side of the substrate which minimizes or eliminates the tendency of the semiconductor device supported on the opposite side of the substrate to cause the substrate to curl. Also disclosed are devices and structures made by this method.
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