Wafer gripping fingers to minimize distortion
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United States of America Patent
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Feb 13, 2007
Grant Date -
Feb 10, 2005
app pub date -
Jun 24, 2004
filing date -
Mar 16, 2000
priority date (Note) -
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Abstract
An apparatus for measuring semiconductor wafer shape that minimizes wafer distortion. The apparatus includes a plurality of wafer gripping fingers for holding a wafer in a predetermined position during wafer measurement. Each finger includes a groove that contacts the edge of the wafer. The groove and the wafer edge have respective radii of curvature, in which the radius of curvature of the groove is greater than that of the wafer edge. Each finger includes a rigid member having a recess formed in a central location at one end thereof, and a compliant material such as PEEK disposed in the recess in which the groove is formed. The compliant material extends a first distance beyond the rigid member at the central groove location and a second shorter distance beyond the rigid member on each side of the central location. Because the groove areas on each side of the central area are more rigid than the central groove area, the fingers can hold the wafer with a high degree of accuracy while reducing wafer distortion.
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