Envelope having improved overlap profile
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United States of America Patent
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-
Feb 6, 2007
Issued Date -
N/A
app pub date -
Apr 18, 2003
filing date -
Oct 3, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An envelope assembly is provided for improved performance of a mailing envelope in the automated mail handling process. The envelope comprises a front panel having top, bottom and side edges and forming an envelope front surface, side flaps extending front the side edges, a rear panel extending from the bottom edge and combining with the side flaps to form an envelope rear surface, and a closure flap extending from the top edge for securing the envelope in a closed position. The rear panel is sized and configured to have a lesser width than the front panel as to expose the side flaps along the envelope rear surface. In this configuration, an automated mail opening device must only substantially cut through the side flaps and front panel to open the envelope along the side edges, as opposed to having to also cut through a substantial portion of the rear panel and an adhesive holding the rear panel and side flaps together.
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