Encapsulation of electronic devices
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United States of America Patent
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Jan 23, 2007
Issued Date -
N/A
app pub date -
Nov 4, 2004
filing date -
Dec 17, 1999
priority date (Note) -
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Abstract
A method of encapsulating a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.
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