Heat seal blister package having improved moisture vapor transmission barrier and method for forming same
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United States of America Patent
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Jan 23, 2007
Grant Date -
Oct 23, 2003
app pub date -
Apr 19, 2002
filing date -
Apr 19, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat seal blister package having an improved moisture vapor transmission barrier hindering penetration of moisture into the blister package from the surrounding environment to support and protect a product therewithin, and a method for forming same. The blister package includes a substantially paperboard substrate, a coating having moisture vapor transmission barrier properties and heat seal capabilities and a plastic blister attached to at least one side of the substrate over a coated portion of the substrate by a heat seal, to create an enclosed pocket isolated from the surrounding environment, in which to house a product. The coating imparts a moisture vapor transmission barrier to the paperboard substrate to reduce penetration of moisture through the substrate, while simultaneously imparting heat sealing capabilities to the coated portion of the substrate to make the coated portion of the substrate susceptible to a heat seal.
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