Method of fabricating multi layer devices on buried oxide layer substrates
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United States of America Patent
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Jan 16, 2007
Grant Date -
Apr 14, 2005
app pub date -
Nov 20, 2003
filing date -
Sep 12, 2001
priority date (Note) -
Expired
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Abstract
A method for fabricating multi layer devices on a substrate with a buried oxide layer is disclosed. Multi layer microelectromechanical, microfluidic, and integrated circuit devices are fabricated on a substrate with layers of predetermined weak and strong bond regions with deconstructed layers of devices at or on the weak bond regions. The layers are then peeled and subsequently bonded to produce a multi layer microelectromechanical and microfluidic devices. An arbitrary number of layers can be bonded and stacked to create either microelectromechanical or microfluidic device or a hyrbid type of device.
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