Real time monitoring of CMP pad conditioning process

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United States of America Patent

PATENT NO 7163435
APP PUB NO 20060172662A1
SERIAL NO

11047117

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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CMP pad conditioning processes have been monitored and controlled by detecting the vibrational spectrum of a sensor mounted on the conditioner support arm. An accelerometer is used as the detector so that vibrational velocity (which correlates with pad wear) can be measured, rather than displacement or acceleration. After the vibrational spectrum has been transformed to its frequency domain equivalent, it is monitored for the presence of abnormal peaks in order to control the conditioning process.

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Patent Owner(s)

Patent OwnerAddress
TECH SEMICONDUCTOR SINGAPORE PTE LTD1 WOODLANDS INDUSTRIAL PARK D STREET 1 738799

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Kok Eng Singapore, SG 1 23
Lim, Khoon Peng Singapore, SG 11 206

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