Method and composition for polishing a substrate
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United States of America Patent
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Jan 9, 2007
Grant Date -
Mar 18, 2004
app pub date -
Jun 26, 2003
filing date -
Mar 14, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.
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