Use of a low-alloyed copper alloy and hollow profile component made therefrom
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United States of America Patent
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Jan 9, 2007
Grant Date -
Jun 24, 2004
app pub date -
Aug 11, 2003
filing date -
Aug 9, 2002
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Abstract
Use of a low-alloyed, phosphorus-deoxidized copper alloy (DHP-Cu) for manufacturing hollow profile components by internal high-pressure forming, the copper alloy having the following composition: 0.030 to 0.080 wt-% of at least one element of a group including tin (Sn), Zinc (Zn), iron (Fe), silver (Ag) and at least 99.90 wt-% of (Cu) as well as unavoidable impurities as the remainder. Because of its cold work hardening properties, such a copper alloy is especially suitable for the manufacture of hollow profile components by internal high-pressure forming.
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