Metal/ceramic bonding article and method for producing same
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United States of America Patent
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Jan 9, 2007
Grant Date -
Apr 1, 2004
app pub date -
Sep 23, 2003
filing date -
Sep 26, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bond the metal member directly to the ceramic substrate.
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