Wire bonder

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7159751
APP PUB NO 20040245314A1
SERIAL NO

10853328

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
ESEC TRADING SA6330 CHAM

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Vischer, Dieter Zug, CH 6 29

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