Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same

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United States of America Patent

PATENT NO 7157647
SERIAL NO

10882170

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Abstract

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A circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.

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Patent Owner(s)

Patent OwnerAddress
TTM TECHNOLOGIES NORTH AMERICA LLC520 MARYVILLE CENTRE DRIVE SUIT 400 ST LOUIS MO 63141

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Larnerd, James M Binghamton, NY 12 108
Lauffer, John M Waverly, NY 123 2396
Markovich, Voya R Endwell, NY 198 5225

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