Device for removing an injection molded substrate from an injection mold
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United States of America Patent
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-
Jan 2, 2007
Issued Date -
N/A
app pub date -
Apr 22, 2004
filing date -
Oct 26, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device for removing an injection-molded substrate with attached sprue from an injection mold having half-molds, in particular a substrate for optical data carriers, includes a lever that can swing in and out of a position between the half-molds of the injection mold and is constructed to include a substrate retaining mechanism with a substrate retaining member with a recess or an opening sized to hold the substrate and configured to receive the sprue with a pass fit. The substrate retaining member secures the substrate in place as the lever swings in and out of the open half-molds. An injection molding machine using the device is also described. The substrate can be quickly demolded and the sprue removed in a single operation without producing dust in the mold.
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