Laser diode module, laser apparatus and laser processing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 26, 2006
Grant Date -
Mar 31, 2005
app pub date -
Sep 17, 2004
filing date -
Sep 29, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.
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