Process for decreasing the resistivity of conductive flow field plates for use in fuel cells
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United States of America Patent
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Dec 26, 2006
Grant Date -
Mar 11, 2004
app pub date -
Mar 17, 2003
filing date -
Mar 20, 2002
priority date (Note) -
Expired
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Abstract
The present invention provides a process for decreasing the resistivity of a non-machined conductive flow field plate for use in a fuel cell. The process includes the step of annealing the conductive flow field plate by heating the conductive flow field plate to a temperature between 25.degree. C. (room temperature) and a temperature slightly lower than the material softening temperature of the material composition of the conductive flow field plate; maintaining the conductive flow field plate at that temperature for an effective period of time; and, cooling the conductive flow field plate to room temperature.
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