Jet singulation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 26, 2006
Issued Date -
N/A
app pub date -
Aug 30, 2004
filing date -
Sep 13, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully