Method of making high speed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 26, 2006
Grant Date -
Nov 25, 2004
app pub date -
Mar 30, 2004
filing date -
Jan 30, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully