Use of thermoplastic polyamide molding compositions with reduced formation of solid deposits and/or coverings
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United States of America Patent
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Dec 19, 2006
Grant Date -
Jul 7, 2005
app pub date -
Dec 29, 2004
filing date -
Dec 30, 2003
priority date (Note) -
Expired
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Abstract
The present invention relates to the use of thermoplastic polyamide moulding compositions with reduced or strongly reduced formation of solid deposits and/or coverings during a thermoplastic conversion into commodity goods in discontinuous processes in particular injection moulding, and continuous processes such as the extrusion of films, fibers, tubes and jacketings containing at least 20% by weight polyamide and/or at least one copolymer with at least 20% by weight polyamide components.
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