Double side probing of semiconductor devices
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United States of America Patent
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Dec 5, 2006
Issued Date -
N/A
app pub date -
Mar 30, 2005
filing date -
Apr 1, 2004
priority date (Note) -
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Abstract
A probe head for testing the properties of a semiconducting device (10) under test including a dielectric film (24) supporting at least one semiconducting device (10) under test with a support frame (26) tautly supporting the dielectric film (24). A first support (40) positions a first probe (28) for electrically contacting a first side (16) of the semiconducting device (10) under test and a second support (34), having a actuator to move a second probe (30) between a first position (P1) and a second position (P2), positions second probe (30) with the second position (P2) being for electrically contacting an opposing second side (18) of the semiconductor device under test.
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