Method of treating microelectronic substrates
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United States of America Patent
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Nov 28, 2006
Grant Date -
Jul 28, 2005
app pub date -
Jan 22, 2004
filing date -
Jan 22, 2004
priority date (Note) -
Expired
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Abstract
A method of treating a dielectric surface portion of a semiconductor substrate, comprising the steps of: (a) providing a semiconductor substrate having a dielectric surface portion; and then (b) treating said dielectric surface portion with a coating reagent, the coating reagent comprising a reactive group coupled to a coordinating group, with the coordinating group having a metal bound thereto, so that the metal is deposited on the dielectric surface portion to produce a surface portion treated with a metal.
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