Process for the production of high-density printed wiring board
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United States of America Patent
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Nov 28, 2006
Issued Date -
N/A
app pub date -
Jun 14, 2002
filing date -
Jun 29, 2001
priority date (Note) -
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Abstract
Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 .mu.m or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 .mu.m thickness, forming an electrolytic copper plating layer of 0.5 to 3 .mu.m thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 .mu.m thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.
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