Optical printed circuit board and optical interconnection block using optical fiber bundle
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United States of America Patent
Stats
-
Nov 14, 2006
Grant Date -
Mar 2, 2006
app pub date -
Mar 1, 2005
filing date -
Aug 25, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is an optical printed circuit board (PCB) having a multi-channel optical waveguide, which comprises: an optical waveguide having an optical path for transmitting light beams; a groove for penetrating the optical waveguide; and an optical interconnection block inserted in the groove and connected to the optical waveguide to transmit the light beams, wherein the optical interconnection block includes an optical fiber bundle bent by the angle of 90.degree.. The optical interconnection block connects a plurality of multi-layered optical waveguides to transmit light beams to the optical waveguides. The optical fiber bundle is installed as a medium of the multi-channel optical waveguide in the optical PCB.
First Claim
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Cited Art Landscape
Patent Citation Ranking
- 14 Citation Count
- G02B Class
- 44.61 % this patent is cited more than
- 19 Age
