Hermetic seal
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United States of America Patent
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Nov 14, 2006
Grant Date -
Mar 6, 2003
app pub date -
Sep 6, 2001
filing date -
Sep 6, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Ultrasonically formed seals, their use in semiconductor packages, and methods of fabricating semiconductor packages. A brittle center member (such as glass) has a molded edge member. That edge member is ultrasonically welded to a body. The molded edge member and body are comprised of ultrasonically weldable materials. A hermetically sealed semiconductor package includes a lid with a brittle center plate and a molded edge. The molded edge is ultrasonically welded to a body. Locating features that enable accurate positioning of the lid relative to the body, and energy directors can be included. Pins having a relieved portion and a protruding portion can also be hermetically sealed to the body. Such pins can have various lengths that enable stadium-type pin rows. The pins can be within channels, which can hold a sealant. The body can include a device that is electrically connected to the pins.
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