FPD encapsulation apparatus and method for encapsulating the same

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United States of America Patent

PATENT NO 7135090
APP PUB NO 20040089397A1
SERIAL NO

10691617

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.

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Patent Owner(s)

Patent OwnerAddress
RITDISPLAY CORPORATIONNO 12 KUANFU N ROAD HSIN CHU INDUSTRIAL PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Tung-Sheng Hsinchu, TW 9 76
Lin, Yen-Hua Hsinchu, TW 7 12
Su, Yi-Fan Changhua, TW 5 14

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