Power supply without cooling fan
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United States of America Patent
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Nov 7, 2006
Grant Date -
Apr 21, 2005
app pub date -
Oct 16, 2003
filing date -
Oct 16, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention provides a power supply for a computer mainframe, which is cooled by a heat conduction method, and more particularly to a power supply without a cooling fan. The present invention features a highly effective heat pipe connecting a plurality of aluminum-extrusion heat sink fins and a plurality of aluminum-extrusion heat sinks, the aluminum-extrusion heat sink fins fixed above a cooling chip over a circuit board, and the aluminum-extrusion heat sinks fringed near the power supply, with a part of the heat sink fins exposed to the power supply. The heat of a chip is conducted out of the power supply by the aluminum-extrusion heat sink fins, the high-effect heat pipe, and the aluminum-extrusion heat sinks. Therefore, the power supply can reach an expected cooling effect without the cooling fan.
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