Methods and procedures for engineering of composite conductive films by atomic layer deposition
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United States of America Patent
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Oct 31, 2006
Grant Date -
N/A
app pub date -
Aug 30, 2005
filing date -
Apr 17, 2001
priority date (Note) -
Expired
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Abstract
A composite film comprised of three layers is formed by ALD on a substrate with a substrate interface surface. A first layer is coupled to the substrate interface surface. The first layer provides adhesion to the substrate interface surface and initiation of layer by layer ALD growth. A second layer is positioned between the first and third layers and provides a conducting diffusion barrier between the substrate and subsequent overlaying film. A third layer has a surface that is configured to provide adhesion and a texture template in preparation for a subsequent overlaying film. The composite engineered barrier structures are applied to interconnect, capacitor and transistor applications.
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