Encapsulated electronic sensor package
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United States of America Patent
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-
Oct 24, 2006
Grant Date -
Mar 31, 2005
app pub date -
Sep 29, 2003
filing date -
Sep 29, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.
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