Method and apparatus for real time monitoring of electroplating bath performance and early fault detection
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United States of America Patent
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Oct 17, 2006
Grant Date -
Mar 25, 2004
app pub date -
Jul 16, 2003
filing date -
Jul 19, 2002
priority date (Note) -
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Abstract
The present invention relates generally to any plating solution and methods for monitoring its performance. More specifically, the present invention relates to plating bath and methods for monitoring its plating functionality based on chemometric analysis of voltammetric data obtained for these baths. More particularly, the method of the present invention relates to application of numerous chemometric techniques to describe quantitatively plating bath functionality in order to maintain its proper performance.
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