Polyamide-imide resin solution and the use thereof for producing wire enamels

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7122244
APP PUB NO 20040006174A1
SERIAL NO

10362426

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170.degree. C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.

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Patent Owner(s)

Patent OwnerAddress
ALTANA ELECTRICAL INSULATION GMBH46483 WESEL

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2001200220032004200520062007200820092010201120122013201420150255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Konig, Sascha To Hamburg, DE 1 1
Lienert, Klaus Wilhelm Hamburg, DE 5 7
Schmidt, Gerold Hamburg, DE 14 63

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  • 1 Citation Count
  • B05D Class
  • 4.40 % this patent is cited more than
  • 19 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges35466160593214106431601 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475500

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