Accuracy analyzing apparatus for machine tool
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United States of America Patent
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Oct 10, 2006
Grant Date -
Jul 17, 2003
app pub date -
Jan 8, 2003
filing date -
Jan 15, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to an accuracy analyzing apparatus which is capable of efficiently analyzing accuracies of a machine tool including the perpendicularity of a spindle axis and the thermal displacement of a spindle with a higher level of accuracy at lower costs. The accuracy analyzing apparatus (1) comprises a laser oscillator (2) attached to the spindle (26) for emitting a laser beam having a light axis perpendicular to the spindle axis, an imaging device (5, 8) having a light receiving section (5) disposed in the vicinity of the laser oscillator (2) for receiving the laser beam from the laser oscillator (2) by the light receiving section (5) and generating two-dimensional image data, and an analyzer (15) for analyzing the accuracies of the machine tool (20) on the basis of the generated image data.
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