Smooth pads for CMP and polishing substrates

United States of America Patent

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Oct 10, 2006
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Mar 24, 2003
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Mar 25, 2002

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Abstract

Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.

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Patent Owner	Address
THOMAS WEST INC	470 MERCURY DRIVE SUNNYVALE CA 94085

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B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....

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Inventor Name	Address	# of filed Patents	Total Citations
Dietz, Donald P	Mountain View, CA	3	13
West, Thomas E	Portolla Valley, CA	2	8
Wu, Guangwei	Sunnyvale, CA	17	171

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Smooth pads for CMP and polishing substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10397069

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US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 10, 2006	US,7118461,B2 US7118461B2	GRANTED PATENT AS SECOND PUBLICATION
September 25, 2003	US,20030181155,A1 US20030181155A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	7118461
SERIAL NO	10397069
DOCKET NO

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10397069

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