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United States of America Patent
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Oct 3, 2006
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N/A
app pub date -
Oct 6, 2004
filing date -
Jun 30, 2004
priority date (Note) -
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Abstract
A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints respectively positioned in the first recessions for connecting the first device to the lead frame.
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