Methods of forming semiconductor constructions
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United States of America Patent
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Oct 3, 2006
Grant Date -
Nov 17, 2005
app pub date -
May 17, 2004
filing date -
May 17, 2004
priority date (Note) -
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Abstract
The invention includes methods by which a fuse box of a semiconductor construction is fabricated to have a substantially uniform layer over fuses extending therein. In particular aspects, the invention includes methods in which one or more processing steps associated with fabrication and patterning of bond pads and redistribution layers is conducted simultaneously over a fuse box region to form and/or remove materials that are directly over the fuse box region.
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