Patterning method
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United States of America Patent
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Oct 3, 2006
Grant Date -
Aug 11, 2005
app pub date -
Jul 22, 2003
filing date -
Jul 26, 2002
priority date (Note) -
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Abstract
A substrate is patterned by forming an indent region 8 in the surface 10 of a substrate 4 and depositing a liquid material onto the surface 10 at selected locations adjacent to the indent region 8. The liquid material spreads over the surface to an edge of the indent region, at which point further spreading is controlled by the effective enhancement of the contact angle of the liquid material relative to the surface as provided by the indent region.
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