Method of manufacturing semiconductor device
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United States of America Patent
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Oct 3, 2006
Grant Date -
Mar 17, 2005
app pub date -
Sep 17, 2004
filing date -
Sep 17, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
Extremely thin chips laminated to a non-ultraviolet ray curing type adhesive tape are peeled from the tape without giving rise to cracks and chippings. In a center portion of a suction block used for peeling off a chip laminated to a dicing tape, three blocks which push the dicing tape upwardly are incorporated. With respect to these blocks, inside the first block having a largest diameter, there is a second block having a diameter smaller than the diameter of the first block. Further, inside the second block, there is a third block having the smallest diameter. To peel off a chip by pushing a back surface of the dicing tape with the blocks, first of all, the three blocks are simultaneously pushed upwardly by a certain amount and, thereafter, the intermediate block and the inner block are further pushed upward, and, finally, the inner block is further pushed upward.
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