Liquid material evaporation apparatus for semiconductor manufacturing
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United States of America Patent
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Oct 3, 2006
Grant Date -
Oct 23, 2003
app pub date -
Mar 11, 2003
filing date -
Mar 13, 2002
priority date (Note) -
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Abstract
A liquid material evaporation apparatus including a mixing chamber, a flow control unit, a first flow passage for introducing a liquid material, a second flow passage for introducing a carrier gas connected to the mixing chamber through a first nozzle, the first nozzle inhibiting backflow from the mixing chamber into the second flow passage. A third flow passage for discharging evaporated mixed gas is connected to the mixing chamber through a second nozzle, the mixed liquid material and carrier gas being forced through the second nozzle by the flow control unit, the mixed liquid material and carrier gas depressurizing after passing through the second nozzle to evaporate into a mixed gas in the third flow passage. Heat is applied to the mixing chamber and the second and third flow passages to enhance mixing in the mixing chamber and to avoid condensation in the third flow passage.
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