Large scale simultaneous circuit encapsulating apparatus
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United States of America Patent
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Oct 3, 2006
Grant Date -
Dec 22, 2005
app pub date -
Jun 17, 2004
filing date -
Jun 17, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plurality of individual circuits are formed on a substrate. Each of the individual circuits is formed with electrical contacts. A spacer is sealed onto the substrate, the spacer peripherally enclosing each of the individual circuits while exposing the conductive contacts. A cover is positioned over the spacer is and integral with it. First conductive feedthroughs penetrate the cover, the first conductive feedthroughs positioned peripheral to each of the individual circuits. Conductive pads are formed on a bottom surface of the cover, the conductive pads in electrical continuity with the conductive contacts of the individual circuits. Conductive paths are formed on the bottom surface of the cover, the conductive paths each joining at least one of the conductive pads with at least one of the first conductive feedthroughs thereby establishing electrical continuity between the individual circuits and the first conductive feedthroughs so as to establish pin-outs.
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